Reflow temperature3/19/2023 ![]() ![]() Utilizing tapered tooling pins located in the tooling holes of the circuit board (plated or non-plated), a wedge effect is created to secure the printed board to the PCB pocket during solder paste screen print, pick and place, and reflow processes. Threaded inserts may be utilized to secure the PCB board to the carrier within the reflow process. The specific design features chosen for a given SMT pallet are critical to minimizing warpage. SMT carriers prove to be really essential when processing thinner substrates, but quite often prove beneficial with substrates that are considered “thick”. Providing mechanical support throughout the entire SMT line (top and bottom assembly) can reduce warpage of rigid PCBs, rigid-flex boards and flex circuits that can significantly reduce yields. There is a short of items to consider when reviewing the advantages of reflow carriers and the design elements that are important. Whenever reflow carriers are being considered and/or evaluated, take the time necessary to remind yourself of the benefits of using an carrier and how you would want it designed. Oftentimes only mechanical support is considered when deciding to use of reflow carriers, but there are many purposes and advantages. This tool is not new to the electronic manufacturing industry, and it’s a proven part of designing a robust PCB assembly process. Reflow carrier is often an essential part of achieving consistent, highest quality success with new product introduction (NPI) or high-volume PCB assembly runs. Sometimes, rigid board assembly may or may not requires reflow carrier, but if you are working with flex PCB assembly, your SMT assembly absolutely requires it. ![]()
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